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Pitting This is caused by low antipit, poor agitation or circulation, boric acid imbalance, or the presence of organics. In testing for antipit, the solution should hold bubble for 5 sec. in a 3 in. wire ring and for less than 5 sec. in a 5 in. ring. In the case of severe pitting, cool to room temperature, add 1 pt/200 gal hydrogen peroxide (35 percent), bubble air, and reheat to 140 F. Carbon-treat as described in Sec. 29.9.1.1. Adjust pH before restarting. Stress This refers to the cause of deposit cracking. Although low nickel chloride causes poor anode corrosion (a rapid decrease in nickel content), high chloride causes excess stress. To prevent this, maintain pH, current density, and boric acid for control below 10 kpsi. Burns A low level of nickel sulfamate causes high-current-density burns. Common treatment includes the following:

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The rolling element bearing is believed to have been invented at around the same time as the wheel Early bearings were made from either wood or leather and were lubricated with animal fat At that time, bearings were used in a manner similar to the bearing systems in modern day cars The technology essentially begins with the development of lubrication and rolling elements that are used in moving heavy stones, building blocks and carvings, water-raising equipment and windmills [1] The progress and development over the years as a result of exacting technology and sophisticated science has led to a significant improvement in the precision of bearings [1]

Hull cell Plate at 2 A for 10 min. with gentle agitation. This test is useful for bath condition and contaminants.

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Visual observation The plated metal has a matte, dull finish. Burned deposits are caused by low temperature, high-current density, bath imbalance, and poor agitation. Rough deposits are due to poor filtration, pH out of spec, contamination, or high-current density.

The SRAM is available on most high-end processors. The amount varies from 128 bytes to 4 Kbytes. The SRAM is accessed using the many data access instructions either directly or indirectly using a pointer register. The SRAM is used for the stack also. The SRAM access time is two clock cycles, as illustrated in Figure 3.7.

Pitting is due to low antipit, poor agitation, bath imbalance, or organic contamination. Low plating rates are due to low pH, low-current density, or impurities. Gassing at the cathode is a sign of low plating rates.

Nickel Sulfate This is typically plated with an automatic edge connector (tip) plating machine. Table 29.9 gives the operating conditions that apply to these systems. For additional instruction, follow the details in Sec. 29.9.1.

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In order to clearly understand the idea behind rolling element bearings, the definition of friction is first presented Friction is the resistance to relative motion of contacting bodies The measurement of friction, usually defined as the coefficient of friction, is a ratio of the tangential force required to initiate or sustain relative motion to the normal force that presses the surfaces together There are two types of frictions, namely, sliding friction and rolling friction as shown in Figure 61 Generally, rolling friction is less than sliding friction, and this became the principle behind rolling element bearings Other terms that may be used to describe this class of bearings are rolling-contact bearings, antifriction bearings and rolling bearings [4] Other bearing types with sleeves and journals utilize sliding friction, but they usually have an additional layer of lubricant

TABLE 29.9 Nickel Sulfate: Operation and Control Operating conditions: pH Nickel Nickel chloride Boric acid Stress reducer Antipit Temperature Cathode current density Current efficiency Anodes: Composition

1.5 4.5 15 17 oz./gal 2 4 oz./gal (with soluble anodes) 5 7 oz./gal As required As required 130 5 F 100 600 A/ft2 65% Nickel or platinized titanium

Nickel anodes are preferred in tip machines because the pH and the metal content remain stable. The pH will decrease rapidly when insoluble anodes are used. The pH should be maintained at 1.5 or higher with additions of nickel carbonate. Stress values are higher than in sulfamate baths, with values of about 20 kpsi.

Early printed circuit board technology used gold extensively. In addition to being an excellent resist for etching, gold has good electrical conductivity, tarnish resistance, and solderability after storage. Gold can produce contact surfaces with low electrical resistance. In spite of its continued advantages, the high cost of gold has restricted its major application to edge connectors (tips) and selected areas, with occasional plating on pads, holes, and traces (body gold). Both hard-alloy and soft, pure gold are currently used. Plating solutions are acid (pH 3.5 to 5.0) and neutral (pH 6 to 8.5). Both automatic plating machines for edge connectors and manual lines are in use.

FIGURE 3.31 Details of one of the port bits (PORTD4).

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